Mark/Resin Removal Device "AIGAMO"
We have resolved issues such as "resin chipping" and "chip cracks."
"AIGAMO" is a device equipped with a laser marking system that performs marking on lead frames and deburring and removal of resin parts. In recent years, it has been used to solve issues in the processing of miniaturized semiconductor products, such as "chipping of the resin that shapes the elements" and "rapid damage and wear of the mold's punch and die," and it is appreciated for the production of various semiconductor products. [Features] - Equipped with a laser irradiation device - Reduces the defect rate of semiconductor products - Reduces maintenance work on molds *For more details, please feel free to contact us.
- Company：大洋電産 伊丹工場
- Price：Other
